Deliverables

Publications

Smart Grid Configuration Tool for HEES systems in smart city districts 

Brunelli, D., & Rossi, M..
  • In 2016 International Symposium on Power Electronics, Electrical Drives, Automation and Motion (SPEEDAM), 2016.

Near-Optimal Thermal Monitoring Framework for Many-Core Systems-on-Chip 

Juri Ranieri, Alessandro Vincenzi, Amina Chebira, David Atienza, Martin Vetterli, 
  • IEEE Transactions of Computers, ISSN: 0018-9340, Vol. 64, Issue: 11, pp. 3197-3209, DOI: 10.1109/TC.2015.2395423, IEEE Computer Society, November 2015.

Design optimization of zero power wake-up receiver in Power line communication

Golchin, P.; Tosato, P.; Brunelli, D.
  • International Symposium on Power Electronics, Electrical Drives, Automation and Motion (SPEEDAM), 2016

Design Optimization of Single-Phase PFC Rectifier Using Pareto-Front Analysis and Including Electro-Thermal Modelling

Mahmoud Ibrahim, Pierre Lefranc, Luc Gonnet, David Frey, Jean-Paul Ferrieux
  • 41st Annual Conference of the IEEE Industrial Electronics Society (IECON2015), Nov 2015

GPU Acceleration for simulating massively parallel many-core platforms

Shivani Raghav, Christian Pinto, Martino Ruggiero, Andrea Marongiu, David Atienza, Luca Benini
  • IEEE Transactions on Parallel and Distributed Systems (TPDS), ISSN: 10459219, Vol. 26, Issue/Nr: 5, pp. 1336-1349, DOI: 10.1109/TPDS.2014.2319092, IEEE Computer Society, May 2015.

Document PDFGPR Acceleration for simulating massively parallel many-core platforms

The EU's many data center efforts

http://bit.ly/1B10PgD

A Semi-Analytical Thermal Modeling Framework for Liquid-Cooled ICs

Arvind Sridhar, Mohamed Sabry, David Atienza
  • IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (T-CAD), IEEE Press, ISSN: 0278-0070, Vol. 33, Issue/Nr: 8, pp. 1145-1158, DOI: 10.1109/TCAD.2014.2323194, Oct-Nov. 2014

Document PDFA Semi-Analytical Thermal Modeling Framework for Liquid-Cooled ICs

3D-ICE: a Compact Thermal Model for Early-Stage Design of Liquid-Cooled ICs

Arvind Sridhar, Alessandro Vincenzi, David Atienza, Thomas Brunschwiler
  • IEEE Transactions of Computers, ISSN: 0018-9340, Vol. 63, Issue: 10, pp. 2576-2589 DOI: 10.1109/TC.2013.127, IEEE Computer Society, October 2014

Document PDF3D-ICE:a Compact Thermal Model for Early-Stage Design of Liquid-Cooled ICs

Integrated Microfluidic Power Generation and Cooling for Bright Silicon MPSoCs

The soaring demand for computing power in our digital information age has produced as collateral undesirable effect a surge in power consumption and heat density for computing servers. Accordingly, 30-40% of the energy consumed in state-of-the-art servers is dissipated in cooling. The remaining energy is used for computation, and causes the temperature ramp-up to operating conditions that already preclude operating all the cores at maximum performance levels, in order to prevent system overheating and failures. This situation is set to worsen as shipments of high-end (i.e., even denser) many-core servers are increasing at a 25% compound annual growth rate. Thus, state-of-the-art worst-case power and cooling delivery solutions on servers are reaching their limits and it will no longer be possible to power up simultaneously all the available on-chip cores (situation known as the existence of "dark silicon"); hence, drastically limiting the benefits of technology scaling. This presentation aims to completely revise the prevailing worst-case power and cooling provisioning paradigm for servers by championing a disruptive approach to computing server architecture design that prevents dark silicon. This proposed approach integrates a flexible heterogeneous many-core architecture template with an on-chip microfluidic fuel cell network for joint cooling delivery and power supply (i.e., local power generation and delivery), as well as a holistic power-temperature model predictive controller exploiting the server software stack, in order to achieve scalable and energy-minimal server architectures. Thanks to the disruptive system-level many-core architecture with microfluidic power and cooling delivery, as well as the complementary temperature control, we can envision the removal of the current limits of power delivery and heat dissipation in server designs, subsequently avoiding dark silicon in future servers and enabling new perspectives in future energy-proportional server designs.


Document PDFIntegrated Microfluidic Power Generation and Cooling for Bright Silicon MPSoCs

Global Fan Speed Control Considering Non-Ideal Temperature Measurements in Enterprise Servers

Time lag and quantization in temperature sensors in enterprise servers lead to stability concerns on existing variable fan speed control schemes. Stability challenges become further aggravated when multiple local controllers are running together with the fan control scheme. In this paper, we present a global control scheme which tackles the concerns on the stability of enterprise servers while reducing the performance degradation caused by the variable fan speed control scheme. We first present a stable fan speed control scheme based on the Proportional-Integral-Derivative (PID) controller by adaptively adjusting the PID parameters according to the operating fan speed and eliminating the fan speed oscillation caused by temperature quantization. Then, we present a global control scheme which coordinates control actions among multiple local controllers. In addition, it guarantees the server stability while minimizing the overall performance degradation. We validated the proposed control scheme using a presently shipping commercial enterprise server. Our experimental results show that the proposed fan control scheme is stable under the non-ideal temperature measurement system (10 sec in time lag and 1C in quantization figures). Furthermore, the global control scheme enables to run multiple local controllers in a stable manner while reducing the performance degradation up to 19.2% compared to conventional coordination schemes with 19.1% savings in power consumption


Document PDFGlobal Fan Speed Control Considering Non-Ideal Temperature Measurements in Enterprise Servers

A Semi-Analytical Thermal Modeling Framework
for Liquid-Cooled ICs

  • IEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS, VOL. 33, NO. 8, AUGUST 2014

With the development of liquid-cooled integrated circuits (ICs) using silicon microchannels, the study of heat transfer and thermal modeling in liquid-cooled heat sinks has gained interest in the last five years. As a consequence, several methodologies on the thermally-aware design of liquid-cooled 2-D/3-D ICs and multiprocessor system-on-chips (MPSoCs) have appeared in the literature. A key component in such methodologies is a fast and accurate thermal modeling technique that can be easily interfaced with design optimization tools. Conventional fully numerical techniques, such as finite-element methods, do not render themselves to enable such an easy interfacing with design tools and their order of complexity is too large for fast simulations. In this context, we present a new semi-analytical representation for heat flow in forced convective cooling inside microchannels, which is continuous in 1-D, i.e., along the direction of the coolant flow. This model is based on the well-known analogy between heat conduction and electrical conduction, and introduces distributed electrical parameters in the dimension considered to be continuous, resulting in a state-space representation of the heat transfer problem. Both steady state and transient semi-analytical models are presented. The proposed semi-analytical model is shown to have a closed-form solution for certain cases that are encountered in practical design problems. The accuracy of the model has been validated against state-ofthe- art thermal modeling frameworks [1] (errors 1%), with 3X
speed-up of our proposed modeling framework.


Document PDFA Semi-Analytical Thermal Modeling Framework

Wireless Sensor Networks for Environmental Monitoring
powered by Microprocessors Heat Dissipation

Luca Rizzon, Maurizio Rossi, Roberto Passerone and Davide Brunelli University of Trento, Italy {name.surname}@unitn.it

We present an energy harvesting solution for a wireless sensor network for indoor environmental monitoring in data centers. The energy that supplies the nodes is harvested from the heat generated by the server microprocessors using Thermo Electric Generators (TEG), which convert a temperature gradient into electrical energy. We present a performance comparison between two commercial TEGs under different server processor load profiles. We focus our attention on server boards based on ARM CPUs (Arndale with ARM Cortex A15 and Pandaboard with ARM Cortex A9), supplying nodes equipped with gas sensors. From our results and simulations, we are able to demonstrate the possibility of powering a perpetual environmental monitoring WSN with a 0.0027% duty-cycle with the energy scavenged from computationally intensive embedded platform.


Document PDFWireless Sensor Networks for Environmental Monitoring powered by Microprocessors Heat Dissipation

Presentations

GreenDataNet Energy Storage and Control Center Presentation - 8th December 2015